Chipmakers are using more and different traditional tool types than ever to find killer defects in advanced chips, but they are also turning to complementary solutions like advanced forms of machine ...

Several equipment makers are ramping up new inspection equipment to address the growing defect challenges in IC packaging. At one time, finding defects in packaging was relatively straightforward. But ...

The IDDQ test relies on measuring the supply current (I DD) of an IC’s quiescent state, when the circuit isn’t switching and inputs are held at static values. Test patterns are used to place the ...

What if manufacturing companies could pinpoint the exact cause of a defect the moment it occurs, preventing costly production delays and ensuring top-notch quality? Generative artificial intelligence ...