With the semiconductor industry moving toward 3D DRAM, 3D logic architectures, and 1000+ layer 3D NAND stacks, 1 mechanical failures may become more common. Due to the complexity of these structures, ...

FuGasity Corp. today said it has received a notice of allowance for a patent from the U.S. Patent and Trademark Office. The patent would cover the Allen, Texas-based company’s technology for ...

Taking place at the end of the semiconductor process flow, dicing is the process where the silicon wafer is finally turned into individual chips, or die, traditionally by means of a saw or laser. A ...

The SOC designer's world is made up of two distinct groups-the logic, or system-level, designers and the physical-layout designers. Logic designers work on functional and timing issues, and physical ...

The semiconductor manufacturing process involves many steps, including, but not limited to, film deposition, photolithography, etching, and chemical mechanical polishing (CMP). Contamination can ...

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DOWNERS GROVE, Ill., Oct. 29, 2025 /PRNewswire/ -- Malema™, part of PSG and Dover (NYSE: DOV) and a leading provider of flow meter technologies for use in industrial and semiconductor applications, ...